Post-Reflow AOI: Automated Inspection to Improve Welding Quality
We have discussed the Pre-reflow AOI. Today we will discuss Post-reflow inspection. Both pre-furnace and
post-reflow inspection methods are identical.
After reflowing, AOI can be performed. Post-reflow AOI can effectively improve print circuit board
quality and reliability.
Post-Furnace AOI: What Is Its Role?
The main function of the post-furnace inspection is to detect defects, such as missing or wrong parts,
solder bridges, solder joints that are empty, solder joints that are cold, and solder joints with no
solder.
Advantages of Post-Reflow AOI
The following benefits are associated with AOI post-furnace:
The inspection is able to detect defects even after welding.
It can automate testing and increase testing efficiency. It can generate a testing report for easier
management and traceability.
Post-Furnace Application Scope
The scope of application for post-furnace AOI is:
Consumer electronics includes mobile phones, computers and televisions.
Industrial control products: For example, robots, automotive electronics, etc.
Medical devices: For example, pacemakers, MRIs, etc.
The Specific Location of AOI After the Furnace
The location of the AOI post-furnace can be determined by the actual SMT product line situation.
In general, the post-reflow AOI is installed at the exit of the reflow oven to detect circuit boards
that have been soldered.
Future Development of Post Furnace AOI
Artificial Intelligence: AI helps post-furnace AOI to automatically detect and identify more complex
welding defects.
3D technology for detection: This technology allows you to detect poor welds more accurately.
Big Data Analysis Technology: The use of big data analysis technology to improve efficiency and accuracy
in post-furnace AOI.
The development of AOI post-furnace technology will be driven by these trends, which will help to
improve the product quality and reliability.
