Pouring Glue and Gluing Methods Are Used for SMT Assembly

In the manufacture of electronic products, SMT assembly plays a major role. Gluing and filling processes
are vital.

Pouring and gluing glue protects and packages electronic components. It also improves the waterproof,
dustproof and shockproof qualities of the product.

What Is the Difference Between Filling and Gluing?

The two processes of gluing and pouring adhesive are different.

Pouring glue is the same as squeezing glue into the space where the adhesive needs to stick.

The glueing is used to bond small areas. Pouring glue can be used to fill large spaces or areas.

Method of Gluing Patches Processing

In the patch-processing industry, there are two main methods for gluing: dispensing or potting.

1) Glue Dispensing

The glue is dispensed by squeezing it through a nozzle or needle to the desired location. The glue
dispensing procedure is easy and ideal for small batches.

Contact dispensing is the most common method, followed by non-contact dispensing.

• Contact dispensing – The adhesive is squeezed out by the needle or nozzle when it
contacts the adherend.

Contact dispensing has the advantage that it’s easy to use. It is not precise and can cause bubbles.

• Non-contact dispensing : The needle or the nozzle do not contact the surface directly.
The glue is squeezed out using air pressure or vibration.

Non-contact dispensing is more precise. The operation is more complex, but it is less likely that
bubbles will form.

2) Potting

Potting is the process of injecting glue in the designated space.

The potting method is ideal for large-scale production. There are three main methods of potting:
mechanical, automatic, and manual.

• Manual potting – Use hand tools to inject the glue into the space reserved. Manual
potting is cheaper, but less efficient and it’s difficult to guarantee accuracy.

• Mechanical potting – Use a mechanical device to inject glue in the designated space.
Mechanical potting is more effective but also more expensive.

• Automatic potting – Use an automatic machine to inject the glue in the designated
space. The most efficient, but also most expensive method of potting is automatic potting.

Process for SMT Glue and Glue Filling

The following steps are generally involved in gluing and filling a patch:

1) Prepare the Glue

This includes cleaning and selecting the right glue as well as configuring it.

Pouring glue or gluing: Select the method that best suits your needs.

2) Curing

Check the effect of the glue or pouring gum after curing.

Precautions When Using Glue in the Patching Process

You should take note of the following when gluing or filling SMT mounts:

• The adherend surface should be dry and free from oil, dust etc.

• The adhesive should be selected according to the material that will be adhered.

• Please follow all instructions when preparing the glue.

• To avoid bubbles, adhere or pour gum according to the manufacturer’s instructions.

• Check the effect of the glue or filler after it has been cured to make sure that they meet your
requirements.

Use of Glue Fillings in Patch Manufacturing

The technology of SMT’s pouring and gluing gum is widely used in the electronic product industry.
This includes mainly these aspects:

Encapsulation of electronic components and protection: By gluing and potting electronic components, they
can be protected from damage by dust, water, vibration and other factors.

The product’s waterproofing and dustproofing performance can be improved by gluing and filling. It
increases the life expectancy of the product.

Gluing or pouring gums can act as heat conductors and insulations, improving the performance of the
product.

Conclusion

The glueing and filling process is an important part of patch processing. It has a major impact on the
performance and reliability of electronic products.

To ensure quality, it is important to follow all the requirements when performing SMT gluing.