What Are the Different Types of PCB Surface Treatment Processes?

PCB production has also changed dramatically,
as the demand for modern item technology is increasing. Some motherboards are made of gold or copper.
This is similar to the circuit cards in computers and mobile phones.

The PCB Top Quality enables everyone to
identify the surface innovation of printed circuit cards and compares the advantages and disadvantages
of different surface treatment processes on PCBs and their applicable scenarios.

PCB boards are characterized by three main colors: light red, silver and gold. Gold is the most
expensive, followed by silver, and light red is the least expensive. The appearance of the edges can
tell you if the manufacturer has cut them or not. Circuit boards are mainly made of pure copper and
described as “bare copper board”.

1. A bare copper sheet has the advantage of being inexpensive, flat and weldable. Be
careful to not be affected by temperature and acid. After being in the air for a period of time, copper
is easily oxidized.

2. The immersion gold board has gold. The cost of a circuit card is 10% higher if a
thin layer conductor has been layered. It is difficult to oxidize after immersion in gold therapy. It
can also be stored for long periods of time and has a smoother finish. It is suitable for welding
fine-gaps pins, and gadgets that have smaller solder joints such as mobile phones boards. The cost of
this machine is high, and its welding power is poor.

3. Silver is the color of the circuit board spraying tin. The sprayer applies a thin
layer of tin to the outside of the circuit. It is a good welding tool, but does not provide the same
level of long-term reliability as gold. If used for a very long time, it is easy to oxidize or rust.
This can lead to poor call. It is used on some circuit boards for small digital products, and is
inexpensive.

4. The OSP process board, which is used in SMT manufacturing facilities, is also known
as natural flux film. It is cheaper than tin spraying because it is organic and not steel.

This method has all of the benefits of welding copper plates. The surface of the circuit cards can also
be re-treated, but they are more susceptible to acid and moisture. The surface treatment must be
repeated if the storage time exceeds 3 months. OSP is an insulating layer. The test point must be
soldered with paste to remove the OSP before the determine may be used for electrical testing.